Chiplet Innovations
The discussion dives into the emerging technologies of chiplets and 3D stacked DRAM, highlighting their potential to enhance performance without compromising yield. Insights reveal that while chiplets are already implemented in AMD CPUs, the integration of memory on top of logic dies poses cooling challenges for Macs. The conversation hints at the exciting possibilities these advancements could bring to future M-series chips.In this clip
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Accidental Tech Podcast
408: Feature Headphones
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