Intel's Aggressive Roadmap
Stacy discusses Intel's ambitious plan to close the gap with TSMC by 2025, outlining advancements in transistor structures and backside power. Despite the aggressive roadmap, Intel acknowledges a potential four-year lag, leaving a window for competition to capitalize. Intel also explores outsourcing to TSMC and delves into specialized packaging with chiplets, aiming to leverage their packaging technology advantage.In this clip
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